Electronic chip component with an integrated circuit and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – By pressure alone

Reexamination Certificate

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Details

C257S783000, C257S786000, C257S782000, C257S778000

Reexamination Certificate

active

06969917

ABSTRACT:
The invention relates to an electronic chip component and a method for fabricating the chip component with a semiconductor chip having an integrated circuit therein. Contact surfaces are on the active surface of the semiconductor chip. The contact surfaces of the integrated circuit have a contact layer consisting of pressure contact material, which protrudes beyond the level of the top non-conductive layer. The active surface of the semiconductor chip includes a meltable glue layer that is adapted to the height of the contact layer.

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