4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Hai Jeong Sohn

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Dual-lead type square semiconductor package and dual in-line...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Lead frames including extended tie-bars, and semiconductor chip

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Patent

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Lead-on-chip semiconductor package and method for making the sam

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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Method for manufacturing a chip scale package having copper...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1052756

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