Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
Inventor
active
Panel stacking of BGA devices to form three-dimensional modules
Panel stacking of BGA devices to form three-dimensional modules
Post in ring interconnect using for 3-D stacking
Retaining ring interconnect used for 3-D stacking
Thin scale outline package
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Profile ID: LFUS-PAI-P-2619954