Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2005-02-15
2005-02-15
Potter, Roy (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S692000
Reexamination Certificate
active
06856010
ABSTRACT:
The present invention provides a plurality of vertically stacked semiconductor dies which are electrically connected to each other. Each semiconductor die has leads which extend out from at least two opposed side surfaces of the semiconductor die. Each lead defines a first junction, a second junction, an inner width and an outer width. The second junctions of the leads of the upper semiconductor die are electrically connected to the first junctions of the leads of the lower semiconductor die. Additionally, the inner widths of the leads of the upper semiconductor die prior to electrically connecting the leads of the upper and lower semiconductor dies are less than the outer widths of the leads of the lower semiconductor die.
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Mearig Joel Andrew
Roeters Glen E.
Sprint John Patrick
Andrews & Kurth LLP
Potter Roy
Staktek Group L.P.
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