Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
Inventor
active
Anodized aluminum substrate having increased breakdown voltage
Anodized aluminum substrate having increased breakdown voltage
Chamfered electronic package component
Electronic package having controlled epoxy flow
Semiconductor package having a ground or power ring and a metal
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Profile ID: LFUS-PAI-P-652382