Electronic package having controlled epoxy flow

Details Electronic package having controlled epoxy flow Electronic package having controlled epoxy flow

1992-07-13

1993-08-24

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257687, H01L 2302

Patent

active

052391310

ABSTRACT:
There is provided an electronic package assembly having a die attach paddle bonded to the package base by a compliant adhesive. A recessed channel formed in the base is partially overlapped by the die attach paddle. During package sealing, excess adhesive accumulates in the recessed channel, eliminating bridging of the adhesive to the leadframe.

REFERENCES:
patent: 4105861 (1978-08-01), Hascoe
patent: 4451540 (1984-05-01), Baird et al.
patent: 4461924 (1984-07-01), Butt
patent: 4480262 (1984-10-01), Butt
patent: 4594770 (1986-06-01), Butt
patent: 4888449 (1989-12-01), Crane et al.
patent: 4897508 (1990-01-01), Mahulikar et al.
patent: 4939316 (1990-07-01), Mahulikar et al.
patent: 5013871 (1991-05-01), Mahulikar et al.
patent: 5025114 (1991-06-01), Braden
patent: 5066368 (1991-11-01), Pasqualoni et al.
patent: 5073521 (1991-12-01), Braden

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