Chamfered electronic package component

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

Patent

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Details

257710, H01L 2302

Patent

active

054553865

ABSTRACT:
There is disclosed an adhesively sealed electronic package in which a compensation apparatus is provided for excess adhesive. As a result, excess adhesive does not extend beyond the package perimeter, squeeze-out, or travel along the inner lead fingers interfering with wire bonding. The compensation is a chamfer on the peripheral edges and/or interior edges of the package base component and cover component.

REFERENCES:
patent: 4262165 (1981-04-01), Ohwaki et al.
patent: 4703393 (1987-10-01), Yamamoto et al.
patent: 4989930 (1991-02-01), Nakagawa et al.
patent: 5013871 (1991-05-01), Mahulikar et al.
patent: 5239131 (1993-08-01), Hoffman et al.
patent: 5293511 (1994-03-01), Poradish et al.

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