4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Gerhard Heier

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Double-side polishing process with reduced scratch rate and...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Epitaxially coated semiconductor wafer and process for...

Single-crystal – oriented-crystal – and epitaxy growth processes; – Forming from vapor or gaseous state – With decomposition of a precursor
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Method for machining a semiconductor wafer on both sides in...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Process for material-removing machining of both sides of...

Etching a substrate: processes – Nongaseous phase etching of substrate – Using film of etchant between a stationary surface and a...
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Process for the double-side polishing of semiconductor...

Etching a substrate: processes – Planarizing a nonplanar surface
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Profile ID: LFUS-PAI-P-2536134

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