4. Geometrical instruments

Gerald R. Dunn

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Electrical connector for semiconductor device package

Geometrical instruments
Patent

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Machine for bonding leads to non-coplanar substrates

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Including compliant cushioning medium
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Method of removing a soldered integrated circuit package from a

Metal fusion bonding – Process of disassembling bonded surfaces – per se
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Method of soldering joints by moving them through a target area

Metal fusion bonding – Process – Plural joints
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