Method of removing a soldered integrated circuit package from a

Details Method of removing a soldered integrated circuit package from a Method of removing a soldered integrated circuit package from a

1984-09-04

1985-12-31

Godici, Nicholas P.

Metal fusion bonding

Process of disassembling bonded surfaces, per se

228119, B23K 300

Patent

active

045615861

ABSTRACT:
A method is disclosed for removing an integrated circuit package that has multiple leads which are soldered into respective metal plated holes in a printed circuit board. The board is of the type that has internal metal lines which make joints with the metal plating, and the method is adapted to remove the package from the board without overstressing the joints. The method includes the steps of: flowing a liquid on the leads at a temperature higher than the melting temperature of the solder without pulling on the package for a time period .DELTA.t.sub.1 ; and pulling on the package immediately after the end of the .DELTA.t.sub.1 period with a force F.sub.1 =F.sub.3 +(25 to 75)% F.sub.2. Force F.sub.2 is the minimum force that will extract a single soldered lead from the board under the condition the solder is below but within 5.degree. C. of melting; F.sub.3 is the minimum force that will lift the package from a pool of the liquid; and .DELTA.t.sub.1 is the time it takes to pull the package from the board with force F.sub.1 being continuously applied while the liquid is flowing on the package leads to melt the solder plus one to three seconds.

REFERENCES:
patent: 3731866 (1973-05-01), Mason et al.
patent: 3815806 (1974-06-01), Paxton
patent: 4295596 (1981-10-01), Doten et al.
patent: 4506820 (1985-03-01), Brucker

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