Electrical connector for semiconductor device package

Details Electrical connector for semiconductor device package Electrical connector for semiconductor device package

1975-10-10

1976-12-28

Tupman, W.

Geometrical instruments

339 75MP, 339275B, H05K 112

Patent

active

039998274

ABSTRACT:
A unique contact pin configuration for an electrical connector provides an advantageous connection with a leadless semiconductor device package and a printed circuit board on which the connector is to be mounted. Each contact pin includes an elongated shaft portion, a resilient contact portion and a crossbar portion which offsets the contact portion from the shaft portion of the contact pin. Each contact pin is alternately situated 180.degree. in cavities disposed on two opposed sides of the connector. Consequently, the contact portions of the contact pins provide internal electrical connection to a leadless semiconductor device package with a small contact pad spacing, while providing an external electrical connection via the contact pin shaft portions with a larger spacing therebetween. Also described herein are distinctive stand-off bumps which are coaxial with the shaft portions of the contact pins to insure level mounting onto a printed circuit board.

REFERENCES:
patent: 3660803 (1972-05-01), Cooney
patent: 3696323 (1972-10-01), Kinkaid et al.
patent: 3831131 (1974-08-01), Woodcock et al.

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