Method of soldering joints by moving them through a target area

Details Method of soldering joints by moving them through a target area Method of soldering joints by moving them through a target area

1987-05-04

1988-12-06

Silverberg, Fred A.

Metal fusion bonding

Process

Plural joints

2281082, 228240, 228242, B23K 3102

Patent

active

047890967

ABSTRACT:
A method of soldering component leads to I/O pads on a printed circuit board, without desoldering any other circuit components which were previously soldered to the board near the pads, includes the steps of: forming a mechanical assembly in which respective joints of the pads and the leads and respective solder mounds are mechanically held together; moving the assembly at a predetermined speed on a conveyor such that the joints, but not the previously soldered components, sequentially pass through a target area which is small relative to the total number of joints; and melting and then hardening the solder mounds, without desoldering the previously soldered components, by directing a focused stream of hot gas at the target area as the joints move therethrough on the conveyor.

REFERENCES:
patent: 3516155 (1970-06-01), Smith
patent: 4311267 (1982-01-01), Lim
patent: 4504008 (1985-03-01), Kent et al.
patent: 4505035 (1985-03-01), Burton et al.
patent: 4653682 (1987-03-01), Dines et al.

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