Material or article handling
Horizontally swinging load support
Swinging about pivot
Inventor
active
Die thinning processes and structures
Process chamber for semiconductor substrates
Removal of integrated circuits from packages
Robotic wafer handler
Semiconductor wafer coating apparatus with angular oscillation m
No associations
LandOfFree
Gary B. Tepolt does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Gary B. Tepolt, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Gary B. Tepolt will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-112456