Die thinning processes and structures

Details Die thinning processes and structures Die thinning processes and structures

2011-06-14

2011-06-14

Smith, Matthew S (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S458000, C438S118000, C438S460000, C438S464000, C257S738000, C257S777000, C257S787000, C257SE23098

Reexamination Certificate

active

07960247

ABSTRACT:
Microelectronic dies are thinned according to a variety of approaches, which may include bonding the dies to a substrate under vacuum, disposing a film over the dies and the substrate, and/or changing a center of pressure during thinning.

REFERENCES:
patent: 4266334 (1981-05-01), Edwards et al.
patent: 4735679 (1988-04-01), Lasky
patent: 5144747 (1992-09-01), Eichelberger
patent: 5250843 (1993-10-01), Eichelberger
patent: 5480842 (1996-01-01), Clifton et al.
patent: 6013534 (2000-01-01), Mountain
patent: 6017822 (2000-01-01), Mountain
patent: 6020646 (2000-02-01), Boyle et al.
patent: 6492195 (2002-12-01), Nakanishi et al.
patent: 6506664 (2003-01-01), Beyne et al.
patent: 6762074 (2004-07-01), Draney et al.
patent: 6861336 (2005-03-01), Hampton
patent: 6882036 (2005-04-01), Draney et al.
patent: 7122447 (2006-10-01), Abe et al.
patent: 7271033 (2007-09-01), Lin et al.
patent: 7292381 (2007-11-01), Patterson et al.
patent: 2003/0045072 (2003-03-01), Jiang
patent: 2003/0060034 (2003-03-01), Beyne et al.
patent: 2003/0070517 (2003-04-01), Tsujimoto
patent: 2004/0009649 (2004-01-01), Kub et al.
patent: 2004/0097054 (2004-05-01), Abe
patent: 2004/0203188 (2004-10-01), Draney et al.
patent: 2006/0046350 (2006-03-01), Jiang et al.
patent: 2006/0270104 (2006-11-01), Trovarelli et al.
patent: 2006/0275941 (2006-12-01), Oliver et al.
patent: 2008/0001268 (2008-01-01), Lu
patent: 1 152 464 (2001-11-01), None
patent: 1152464 (2001-11-01), None
patent: WO-99/25019 (1999-05-01), None
Cobb et al. “Process Considerations for Manufacturing 50 μm Thinned III-V Wafers” [online]. CS Mantech Conference, May 14-17, 2007, Austin, Texas, USA, pp. 21-23. [retrieved Apr. 2, 2008]. Retrieved from the the Internet: <http://www.gassmantech.com/Digests/2007/2007%20Papers/02a.pdf>, 3 pages.
Gurnett et al. “Ultra-Thin Semiconductor Wafer Applications and Processes” [online]. III-Vs Review, vol. 19, Issue 4, May 2006, pp. 38-40, [retrieved Feb. 6, 2008]. Retrieved from the Internet: <http://www.sciencedirect.com/science?—ob=ArticleURL&—udi=B6VM5-4K77FTN-1R&—urlVersion=0&—userid=2502287&md5=1403c25b9264197f5d7c82e0256d59a3>, 6 pages.
“Technology Profile Fact Sheet: Wafer and Die Thinning Technology” [online]. National Security Agency, Central Security Service [retrieved Feb. 6, 2008]. Retrieved via the Internet: >http://www.nsa.gov/techtrans/tech00058.cfm>, 2 pages.
Partial International Search Report for PCT/US2009/039450, mailed Jul. 22, 2009.
International Search Report and Written Opinion for PCT/US2009/039450, mailed Sep. 9, 2009.

Affiliated with

Also associated with

Rating

Die thinning processes and structures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Die thinning processes and structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die thinning processes and structures will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2726270