Semiconductor wafer coating apparatus with angular oscillation m

Details Semiconductor wafer coating apparatus with angular oscillation m Semiconductor wafer coating apparatus with angular oscillation m

1988-05-24

1989-07-25

Beck, Shrive

Coating apparatus

With means to centrifuge work

118 56, B05C 1102

Patent

active

048502995

ABSTRACT:
In the coating apparatus disclosed herein, a semiconductor wafer is held on a vacuum chuck mounted on the spindle of a bidirectional servo motor. The servo motor is energized by a servo amplifier in response to the amplitude of the control signal provided to the amplifier. Dispensing means are provided for placing coating material on wafer held in the chuck. An oscillator is provided generating a periodic output signal of controllable amplitude and period. A programmable sequencer is operative in a first time period for appying the oscillatory output signal as a control signal to the servo amplifier thereby to angularly oscillate a wafer held in the chuck and for operating the dispensing means to place a predetermined amount of coating material on the wafer. The sequencing means is operative in a later time period for applying a fixed higher amplitude control signal to the servo amplifier thereby to spin the wafer and spread the coating material.

REFERENCES:
patent: 2950990 (1960-08-01), Johnson

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