4. Metal fusion bonding
  5. Process
  6. Plural joints

Fuaida Harun

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Bonding pad for a packaged integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Integrated circuit die having a copper contact and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Wirebonding insulated wire

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Wirebonding insulated wire and capillary therefor

Metal fusion bonding – Process – Using high frequency vibratory energy
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2858947

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