4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates

Frank Reichenbach

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Method for joining a silicon plate to a second plate

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
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Micromechanical component

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
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Micromechanical component and corresponding method for its...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate

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Sensor with at least one micromechanical structure and...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate

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Sensor with at least one micromechanical structure, and...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
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Profile ID: LFUS-PAI-P-2854944

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