Micromechanical component

Details Micromechanical component Micromechanical component

2006-07-24

2009-02-24

Pham, Hoai v (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Housing or package filled with solid or liquid electrically...

C257S724000, C257S787000, C257SE23116, C257SE23128

Reexamination Certificate

active

07495328

ABSTRACT:
A micromechanical component has a structure such that a material flow is guided from at least one preferred direction for the purpose of uniformly enveloping the micromechanical component.

REFERENCES:
patent: 5984162 (1999-11-01), Hortaleza et al.
patent: 5998243 (1999-12-01), Odashima et al.
patent: 6028368 (2000-02-01), Abe
patent: 2002/0050630 (2002-05-01), Tiziani et al.
patent: 2007/0272993 (2007-11-01), Haag et al.
patent: 2007/0288139 (2007-12-01), Schillinger et al.
patent: 195 37 814 (1997-05-01), None
Micromachining and Microfabrication Process Technology VI, Proceedings of SPIE vol. 4174 (2000) pp. 377-387.

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