Sensor with at least one micromechanical structure and...

Details Sensor with at least one micromechanical structure and... Sensor with at least one micromechanical structure and...

2005-08-30

2005-08-30

Tran, Minh-Loan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S417000, C257S418000, C257S419000, C257S420000

Reexamination Certificate

active

06936902

ABSTRACT:
A sensor has a foundation wafer having a sensor chamber, at least one silicon-based micromechanical structure integrated with the sensor chamber of the foundation wafer, at least one covering that covers the foundation wafer in a region of the sensor chamber, the covering including a first layer which is a deposition layer and is permeable to an etching medium and reaction products, and a hermetically sealing second layer which is a sealing layer and located above the first layer, the deposition layer which is the first layer being permeable in a region of the sensor chamber to the etching medium and a reaction product, the deposition layer for being permeable having structures selected from the group consisting of etching openings, porous regions, and both.

REFERENCES:
patent: 4665610 (1987-05-01), Barth
patent: 4766666 (1988-08-01), Sugiyama
patent: 5139624 (1992-08-01), Searson
patent: 5338416 (1994-08-01), Mlcak
patent: 5919364 (1999-07-01), Lebouitz et al.
patent: 6378378 (2002-04-01), Fisher
patent: 6426239 (2002-07-01), Gogoi et al.
patent: 6478974 (2002-11-01), Lebouitz et al.
patent: 42 41 045 (1994-05-01), None
patent: 195 37 814 (1997-04-01), None
patent: 0 451 992 (1991-10-01), None
patent: 2 198 611 (1988-06-01), None
patent: 97 49475 (1997-12-01), None
Lebouitz K.S., et al: “Permeable Polysilicon Etch-Access Windows . . . ” International Conference on Solid-State Sensors and Actuators and Eurosensors, Jun. 25, 1995, pp. 224-227.
Anderson R.C. et al: “Porous Polycrystalline Silicone . . . ” Journal of Microelectromechanical Systems, Mar. 1994, USA, BD. 3, NR. 1, pp. 10-18.

Affiliated with

Also associated with

Rating

Sensor with at least one micromechanical structure and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sensor with at least one micromechanical structure and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sensor with at least one micromechanical structure and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3504494