Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate
2006-01-25
2010-11-16
Lee, Calvin (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Physical deformation
C438S053000
Reexamination Certificate
active
07834409
ABSTRACT:
A micromechanical component having a conductive substrate, an elastically deflectable diaphragm including at least one conductive layer, which is provided over a front side of the substrate, the conductive layer being electrically insulated from the substrate, a hollow space, which is provided between the substrate and the diaphragm and is filled with a medium, and a plurality of perforation openings, which run under the diaphragm through the substrate, the perforation openings providing access to the hollow space from a back surface of the substrate, so that a volume of the medium located in the hollow space may change when the diaphragm is deflected. Also described is a corresponding manufacturing method.
REFERENCES:
patent: 6140689 (2000-10-01), Scheiter et al.
patent: 6667189 (2003-12-01), Wang et al.
patent: 6790699 (2004-09-01), Vossenberg et al.
patent: 6816301 (2004-11-01), Schiller
patent: 2004/0259286 (2004-12-01), Dehe et al.
patent: 2007/0154040 (2007-07-01), Chen
patent: 2009/0166772 (2009-07-01), Hsieh et al.
patent: 0 969 694 (2000-01-01), None
Scheeper P R et al : “A Review of Silicon Microphones” Sensors and Actuators A, Elsevier Sequoia S.A., Lausanne, CH, vol. A44, No. 1, Jul. 1, 1994, pp. 1-11, XP000469147, ISSN: 0924-4247, figure 9.
Fuchs Tino
Kronmueller Silvia
Laermer Franz
Leinenbach Christina
Reichenbach Frank
Kenyon & Kenyon LLP
Lee Calvin
Robert & Bosch GmbH
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