Metal fusion bonding
Process
With shaping
Inventor
active
Electronic assembly
Electronic package having flip chip integrated circuit and...
Flip chip integrated circuit and passive chip component...
Method and apparatus for use in forming pre-positioned solder bu
Method and structure for attaching a circuit module to a circuit
No associations
LandOfFree
Frank Juskey does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Frank Juskey, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Frank Juskey will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-892769