Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-08-18
2000-10-24
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361702, 361749, 361760, 361762, 361765, 361777, 361743, 257737, 257692, 257292, 2281231, 22818021, 22818022, H05K 118
Patent
active
061376906
ABSTRACT:
An electronic assembly (10) comprises one or more electronic components (18) having solder terminations (20), and a printed circuit substrate (12) having printed circuit traces (14, 16), wherein at least one of the solder terminations of the one or more electronic components (18) and the printed circuit traces (14, 16) of the printed circuit substrate (12) has a secondary finish produced by application of an electrolessly deposited nickel film (26) containing phosphorus which is further plated with gold (28). An indium-tin-lead solder paste (22) is utilized in a soldering process to attached the one or more electronics components (18) to the printed circuit traces (14,16) on the printed circuit board (12), such that the indium-tin-lead solder (22) provides improved solder joint integrity with the secondary finish. The electronic components (18) include semiconductor devices such as ball grid arrays (1000) and flip-chip integrated circuits (1010).
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Carson Robert Thomas
Hogrefe Arnold William
Juskey Frank
Foster David
Macnak Philip P.
Motorola
Picard Leo P.
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