Method and structure for attaching a circuit module to a circuit

Details Method and structure for attaching a circuit module to a circuit Method and structure for attaching a circuit module to a circuit

1995-04-04

1997-02-04

Bradley, P. Austin

Metal fusion bonding

Process

With shaping

22818021, 228254, 174261, 361768, B23K 100, B23K 3102

Patent

active

055989675

ABSTRACT:
A method of interconnecting circuit modules (30) to mother boards (50) each having a plurality of mating solder pads (32, 52) is available. The solder pads (32, 52) have respective pairs of arms (40, 42) and (54, 56) with a venting channel (36, 58) formed between each pair of arms to vent solder medium when the solder pads are reflowed to interconnect the circuit modules and mother boards.

REFERENCES:
patent: 4034149 (1977-07-01), Zaleckas
patent: 4565314 (1986-01-01), Scholz
patent: 4790894 (1988-12-01), Homma et al.
patent: 4889275 (1989-12-01), Mullen, III et al.
patent: 5308928 (1994-05-01), Parla et al.
"Surface Mount Footprint Improvement", IBM. Tech. Discl. Bull., vol. 31, No. 3, (Aug. 1988) pp. 408-409.

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