Metal fusion bonding – Solder form
Patent
1993-05-03
1994-06-28
Ramsey, Kenneth J.
Metal fusion bonding
Solder form
427 96, 156297, 22818022, B23K 308
Patent
active
053239474
ABSTRACT:
A method and apparatus for use in forming pre-positioned solder bumps (104) on a pad arrangement (100) of a substrate (101) include placing a predetermined pattern (306) of solder preforms (304) in contact with a meltable adhesive fluxing agent (302) on a carrier tape (402), and then heating the fluxing agent (302) to melt it. Next, the fluxing agent (302) is cooled to resolidify it, thereby securing the solder preforms (304) to the carrier tape (402). The carrier tape (402) is then aligned over the pad arrangement (100) and the solder preforms (304) are transferred to the pad arrangement (100) by heating the solder preforms (304) to form the solder bumps (104) in the predetermined pattern (306).
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Hendricks Douglas W.
Juskey Frank
Wasko Kenneth M.
Berry Thomas G.
Breeden R. Louis
Motorola Inc.
Ramsey Kenneth J.
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