Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
Inventor
active
Densification in an intermetal dielectric film
Integrated circuit contact barrier formation with ion implant
Integrated-circuit processing with progressive intermetal-dielec
Method of using corrosion prohibiters in aluminum alloy films
Molybdenum boride barrier layers between aluminum and silicon at
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Profile ID: LFUS-PAI-P-622627