4. Semiconductor device manufacturing: process
  5. Coating of substrate containing semiconductor region or of...
  6. Insulative material deposited upon semiconductive substrate

Eugene Joseph Karwacki, Jr.

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Addition of D 2 to H 2 to detect and calibrate atomic...

Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate

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Halogen addition for improved adhesion of CVD copper to barrier

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate

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Halogen addition for improved adhesion of CVD copper to barrier

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Mechanical enhancement of dense and porous organosilicate...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Mechanical enhancement of dense and porous organosilicate...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2179887

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