Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2006-08-29
2006-08-29
Nguyen, Tuan H. (Department: 2813)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S780000
Reexamination Certificate
active
07098149
ABSTRACT:
Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. In one aspect of the present invention, an organosilicate glass film is exposed to an ultraviolet light source wherein the film after exposure has an at least 10% or greater improvement in its mechanical properties (i.e., material hardness and elastic modulus) compared to the as-deposited film.
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Bitner Mark Daniel
Karwacki, Jr. Eugene Joseph
Lukas Aaron Scott
O'Neill Mark Leonard
Vincent Jean Louise
Air Products and Chemicals Inc.
Morris-Oskanian Rosaleen P.
Nguyen Tuan H.
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