Addition of D 2 to H 2 to detect and calibrate atomic...

Details Addition of D 2 to H 2 to detect and calibrate atomic... Addition of D 2 to H 2 to detect and calibrate atomic...

2005-12-09

2008-10-14

McNeil, Jennifer (Department: 4162)

Metal fusion bonding

Process

With protecting of work or filler or applying flux

C216S013000, C216S063000, C216S078000, C205S640000, C219S129000, C219S085220, C257SE21252

Reexamination Certificate

active

07434719

ABSTRACT:
A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and deuterium, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas comprising hydrogen and deuterium between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes to form an emission current between the electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas and molecules of hydrogen bonded to deuterium; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly. Related apparatus is also disclosed.

REFERENCES:
patent: 3343027 (1967-09-01), Frohlich
patent: 3628079 (1971-12-01), Dobbs et al.
patent: 3742213 (1973-06-01), Cohen et al.
patent: 4379218 (1983-04-01), Grebe et al.
patent: 5105761 (1992-04-01), Charlet et al.
patent: 5239161 (1993-08-01), Lang
patent: 5262001 (1993-11-01), Takehara
patent: 5345056 (1994-09-01), Frei et al.
patent: 5409543 (1995-04-01), Panitz et al.
patent: 5433820 (1995-07-01), Sindzingre et al.
patent: 5545894 (1996-08-01), Funsten et al.
patent: 5693241 (1997-12-01), Banks et al.
patent: 5722581 (1998-03-01), Sindzingre et al.
patent: 5744733 (1998-04-01), Bridenbaugh et al.
patent: 5807614 (1998-09-01), Sindzingre et al.
patent: 5807615 (1998-09-01), Sindzingre et al.
patent: 5837958 (1998-11-01), Fornsel
patent: 5858312 (1999-01-01), Sindzingre et al.
patent: 5928527 (1999-07-01), Li et al.
patent: 5941448 (1999-08-01), Sindzingre et al.
patent: 5985378 (1999-11-01), Paquet
patent: 6004631 (1999-12-01), Mori
patent: 6006763 (1999-12-01), Mori et al.
patent: 6007637 (1999-12-01), Sindzingre et al.
patent: 6021940 (2000-02-01), Sindzingre et al.
patent: 6037241 (2000-03-01), Powell et al.
patent: 6077388 (2000-06-01), Freeman
patent: 6089445 (2000-07-01), Sindzingre et al.
patent: 6100496 (2000-08-01), Takuya et al.
patent: 6146503 (2000-11-01), Sindzingre et al.
patent: 6158648 (2000-12-01), Mori et al.
patent: 6174500 (2001-01-01), Uno et al.
patent: 6193135 (2001-02-01), Fang et al.
patent: 6194036 (2001-02-01), Babayan et al.
patent: 6196446 (2001-03-01), Fang et al.
patent: 6203637 (2001-03-01), Dommann et al.
patent: 6277733 (2001-08-01), Smith
patent: 6605175 (2003-08-01), Ramm et al.
patent: 6776330 (2004-08-01), Dong et al.
patent: 6908846 (2005-06-01), McMillin et al.
patent: 7387738 (2008-06-01), Dong et al.
patent: 2004/0038319 (2004-02-01), Aebersold et al.
patent: 2004/0211675 (2004-10-01), Dong et al.
patent: 2006/0191867 (2006-08-01), Hayashi
patent: 196 54 250 (1998-03-01), None
patent: 0 207 731 (1987-01-01), None
patent: 0 997 926 (2000-05-01), None
patent: 1 291 111 (2003-03-01), None
patent: 2 586 334 (1987-02-01), None
patent: 10 314934 (1998-02-01), None
patent: 2002 001253 (2002-01-01), None
patent: WO 00/65887 (2000-11-01), None
patent: WO 01/41963 (2001-06-01), None
Nicolas Potier, et al, “Fluxless Soldering Under Activated Atmosphere..,” Surf. Mount Intl. Conf., 1995, San Jose, Ca.
N. Koopman, et al, “Fluxless Flip Chip Solder Joining,” Nepcon West ′95 Proceedings, pp. 919-931.
P. John Shiloh, et al, “Flux-Free Soldering,” Nepcon West ′94 Proceedings, pp. 251-273.
D. Swanson, “Fluxless Soldering Under Ambient Pressure Plasma Cleaning,” Elec. Packaging and Production, Oct. 1995, p. 32, vol. 35, No. 11.
Mass Spectrometry Detection of Neutral Dissociative Fragments, NTIS, Air Force Inst. of Tech., Wright-Patterson AFB, Oh. Schoo of Engrg., Dec. 1982.

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