Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
Inventor
active
Flip chip power switch with under bump metallization stack
Lead assembly for a flip-chip power switch
Thermally enhanced integrated circuit packaging system
Thermally enhanced thin quad flatpack package
Ultra thin, leadless and molded surface mount integrated circuit
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Profile ID: LFUS-PAI-P-526398