4. Glass manufacturing
  5. Processes
  6. Fusion bonding of glass to a formed part

Diacon Inc.

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Ceramic package system using low temperature sealing glasses

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Leaded chip carrier

Stock material or miscellaneous articles – All metal or with adjacent metals – Width or thickness variation or marginal cuts repeating...
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Leaded chip carrier

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Manufacturing process for package for electronic devices

Glass manufacturing – Processes – Fusion bonding of glass to a formed part
Patent

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Profile ID: LFUS-PAI-P-937481

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