Leaded chip carrier

Details Leaded chip carrier Leaded chip carrier

1985-03-22

1987-03-24

Grimley, Arthur T.

Metal working

Method of mechanical manufacture

Electrical device making

174 52FP, 29416, H01L 2168

Patent

active

046514155

ABSTRACT:
A four quadrant leadframe, base and window assembly and assembly method therefor are disclosed which are suited for fabrication of leaded integrated circuit (IC) chip carriers having electrical contacts on all four sides of the package, lead spacing as small as 0.020 inch, and lead counts exceeding 164 total leads.

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