Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1984-03-30
1986-11-11
Grimley, Arthur T.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
29588, 357 74, 357 78, H01L 2310
Patent
active
046224335
ABSTRACT:
In accordance with the preferred embodiments of the invention, provided is a hermetic ceramic/glass enclosure for encapsulating semiconductor components which reduces the internal cavity moisture and contamination levels, has a stronger package seal and a lower sealing temperature than hermetic ceramic/glass enclosures currently used. Included in the first embodiment is a lower substrate, with a conductive leadframe attached thereto via devitrified glass and a layer of vitreous glass on the leadframe for attaching a cap which also includes a layer of vitreous glass. To seal the enclosure, the cap is heated to a temperature T1 above the melting point of the vitreous glass, and the lower substrate, is maintained at a temperature high enough to bond to the vitreous layer on the cap on contact, but low enough to eliminate damage to the semiconductor component and additional Gold-Silicon eutectic formation between the semiconductor component and the enclosure lower substrate. In a second embodiment, the cap includes heat treated vitreous glass that reduces contamination outgassing during the final enclosure seal process and a gettering pad disposed on the interior surface of the cap for gettering residual moisture from the internal cavity of the enclosure. A third embodiment is also provided which is especially adapted for high pin-count packages, and includes a windowframe on the top of and attached to the leadframe by devitrified glass. The windowframe has a layer of vitreous glass to facilitate final enclosure seal and a reduction in the seal area required.
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Diacon Inc.
Grimley Arthur T.
Smith Joseph H.
Tone D. A.
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