Manufacturing process for package for electronic devices

Details Manufacturing process for package for electronic devices Manufacturing process for package for electronic devices

1977-07-18

1979-02-27

Fisher, Richard V.

Glass manufacturing

Processes

Fusion bonding of glass to a formed part

65 59B, 65 42, 29418, 29630B, C03B 2320, C03C 2702, B23P 1700, H01B 1900

Patent

active

041417127

ABSTRACT:
Semiconductor packages are manufactured according to a method which eliminates or greatly reduces the occurrence of short circuited or otherwise badly positioned leads. The method utilizes a leadframe having a bonding tip support connecting the bonding tips of the leads. After the leadframe is affixed to a ceramic element, the connecting element is removed.

REFERENCES:
patent: 2438046 (1948-03-01), Giannuzzi et al.
patent: 2874363 (1959-02-01), Ainsworth
patent: 3325586 (1967-06-01), Suddick
patent: 3340347 (1967-09-01), Spiegler
patent: 3469017 (1969-09-01), Starger
patent: 3482419 (1969-12-01), Rogers et al.
patent: 3501833 (1970-03-01), Spiegler
patent: 3524249 (1970-08-01), Hamada et al.
patent: 3560180 (1971-02-01), Merat
patent: 4055888 (1977-11-01), Morrill, Jr. et al.

Affiliated with

Also associated with

Rating

Manufacturing process for package for electronic devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing process for package for electronic devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing process for package for electronic devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-720902