Leaded chip carrier

Details Leaded chip carrier Leaded chip carrier

1990-04-25

1991-12-10

Zimmerman, John J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Width or thickness variation or marginal cuts repeating...

174 524, H01L 2348

Patent

active

050717120

ABSTRACT:
A four quadrant leadframe, base and window assembly and assembly method therefor are disclosed which are suited for fabrication of leaded integrated circuit (IC) chip carriers having electrical contacts on all four sides of the package, lead spacing as small as 0.020 inch, and lead counts exceeding 164 total leads.

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