4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Wire contact, lead, or bond

Der-Yuan Wu

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Array for forming magnetoresistive random access memory with...

Static information storage and retrieval – Systems using particular element – Magnetoresistive
Reexamination Certificate

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Bonding pad structure and method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Patent

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Copper fuse structure and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Copper interconnections for metal-insulator-metal capacitor...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Direct determination of interface traps in MOS devices

Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate

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Profile ID: LFUS-PAI-P-375591

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