Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Patent
1995-04-10
1997-12-30
Fahmy, Wael
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
257786, H01L 2348, H01L 2352, H01L 2940
Patent
active
057034087
ABSTRACT:
A structure and a process for forming an improved bonding pad which allows better bonding between a bond wire and a metal bonding pad. Stripes are formed on a substrate. A conformal dielectric layer, a conformal barrier layer and a metal layer are formed over the stripes. A passivation layer with a window is formed defining a bonding pad area. The stripes promote an irregular surface in the barrier and metal layers which reduce stress between the dielectric layer, the barrier layer and the metal layer. Also, the irregular surfaces increase the barrier metal adhesion to the dielectric layer, reduce bond pad peel off, and increase bonding yields.
REFERENCES:
patent: 4600658 (1986-07-01), Anderson et al.
patent: 4800177 (1989-01-01), Nakamae
patent: 5057447 (1991-10-01), Paterson
patent: 5309025 (1994-05-01), Bryant et al.
Chung Hsien-Dar
Hsu Bill Y. B.
Ming-Tsung Liu
Wu Der-Yuan
Fahmy Wael
Raynes Alan S.
United Microelectronics Corporation
Weiss Howard
Wright William H.
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