4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Integrated circuit structure with electrically isolated...
  6. Including dielectric isolation means

Dennis Hausmann

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Adhesion of tungsten nitride films to a silicon surface

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Adhesion of tungsten nitride films to a silicon surface

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Method for improving process control and film conformality...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Vapor deposition of metal oxides, silicates and phosphates,...

Coating processes – Coating by vapor – gas – or smoke – Mixture of vapors or gases utilized
Reexamination Certificate

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Vapor deposition of silicon dioxide nanolaminates

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2247021

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