4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Deepak K. Pai

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Apparatus and method for a segmented squeegee for stenciling

Printing – Stenciling – Traveling-inker machines
Reexamination Certificate

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Apparatus for performing a function on an integrated circuit

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent

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Compliant S-leads for chip carriers

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Hermetically sealed circuit modules having conductive cap anchor

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Laminated multilayer package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Profile ID: LFUS-PAI-P-60080

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