Hermetically sealed circuit modules having conductive cap anchor

Details Hermetically sealed circuit modules having conductive cap anchor Hermetically sealed circuit modules having conductive cap anchor

1992-09-17

1994-01-18

Donovan, Lincoln

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361707, 361760, 361807, 361813, 174 1705, 174 5051, 174 521, 257686, 257700, H05K 114

Patent

active

052804135

ABSTRACT:
A circuit module includes a multilayer circuit board having a plurality of alternate layers defining circuit paths and insulation with conductive vias between selected circuit paths of different layers. A hermetic seal is sealed to the top layer of the multilayer circuit board, and the circuit paths and/or vias are selectively connected to external pads by vias extending through the multilayer circuit board, one via terminating at a pad internal to the sealed region and another via terminating at the external pad. In one form, the vias providing the external connection extend into a substrate supporting the board, and circuit paths in the substrate electrically connect the vias together. In a second form, the vias providing the external connection are electrically connected together by selected circuit paths in the circuit board. A conductive anchor extends through the circuit board to the substrate to provide an anchor for the seal. Where the vias providing external connection are connected by selected circuit paths in the circuit board, the conductive anchor comprises posts having openings through which the selected circuit paths pass.

REFERENCES:
patent: 3693239 (1972-09-01), Dix
patent: 3760090 (1973-09-01), Fowler
patent: 3872583 (1975-03-01), Beall et al.
patent: 4012832 (1977-03-01), Crane
patent: 4023562 (1977-05-01), Hynecek et al.
patent: 4067955 (1978-02-01), Gates, Jr.
patent: 4264917 (1981-04-01), Ugon
patent: 4331258 (1982-05-01), Geschwind
patent: 4539622 (1985-09-01), Akasaki
patent: 4560826 (1985-12-01), Burns et al.
patent: 4631820 (1986-12-01), Harada et al.
patent: 4633573 (1987-01-01), Scherer
patent: 4640436 (1987-02-01), Miyoshi et al.
patent: 4672151 (1987-06-01), Yamamura
patent: 4925024 (1990-05-01), Ellenberger et al.
patent: 4959900 (1990-10-01), do Givry et al.
patent: 5027191 (1991-06-01), Bourdelaise et al.
patent: 5043533 (1991-08-01), Spielberger
patent: 5049978 (1991-09-01), Bates et al.
patent: 5070041 (1991-12-01), Katayama et al.
patent: 5071712 (1991-12-01), Frampton
patent: 5091770 (1992-02-01), Yamaguchi

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