Compliant S-leads for chip carriers

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29854, 361405, H01L 2312, H01L 2348

Patent

active

048276111

ABSTRACT:
A compliant S-shaped lead for resiliently supporting an integrated circuit chip package in spaced relation generally parallel to a printed circuit board. The S-lead bends and twists to absorb forces which would otherwise be exerted on solder joints due to temperature cycling and vibration. The symmetrical S-lead self-centers on both the package and PC board to provide minimum stress. The leads are held by a support strip for connection to the chip carrier. Thereafter, the support strip is removed and the carrier positions the leads for connection to the circuit board.

REFERENCES:
patent: 3676926 (1972-07-01), Kendall
patent: 3769679 (1973-11-01), Kendall
patent: 3877064 (1975-04-01), Scheingold
patent: 4009485 (1977-02-01), Koenig
patent: 4316321 (1982-02-01), Wickham
patent: 4592617 (1986-06-01), Seidler
patent: 4640499 (1987-02-01), Hemler
patent: 4647126 (1987-03-01), Sobota
patent: 4703393 (1987-10-01), Yamamoto

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