4. Metal treatment
  5. Process of modifying or maintaining internal physical...
  6. Processes of coating utilizing a reactive composition which...

David L. Questad

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Apparatus and method for mechanical coupling of land grid...

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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Chip underfill in flip-chip technologies

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Design structure for final via designs for chip stress...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
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Design structure for final via designs for chip stress...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Enhanced solder surface and process for chemically and...

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
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Profile ID: LFUS-PAI-P-1559367

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