Apparatus and method for mechanical coupling of land grid...

Details Apparatus and method for mechanical coupling of land grid... Apparatus and method for mechanical coupling of land grid...

2005-12-27

2005-12-27

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C257S704000

Reexamination Certificate

active

06979782

ABSTRACT:
A land grid array (LGA) assembly includes a chip carrier substrate having at least one chip attached thereto, and a stiffener member attached to the chip carrier substrate, the stiffener member further including a honeycomb material. A cap is attached to the chip and stiffener member.

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