Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate
2008-07-31
2009-06-09
Ha, Nathan W (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
Reexamination Certificate
active
07545050
ABSTRACT:
A design structure to provide a package for a semiconductor chip that minimizes the stresses and strains that arise from differential thermal expansion in chip to substrate or chip to card interconnections. An improved set of design structure vias above the final copper metallization level that mitigate shocks during semiconductor assembly and testing. Other embodiments include design structures having varying micro-mechanical support structures that further minimize stress and strain in the semiconductor package.
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Daubenspeck Timothy Harrison
Gambino Jeffrey P.
Questad David L.
Sauter Wolfgang
Ha Nathan W
International Business Machiens Corporation
The Law Firm of Andrea Hence Evans, LLC
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