4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Insulative housing or support

David Jon Hiner

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Buildup dielectric and metallization process and...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Embedded electronic component package fabrication method

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
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Embedded leadframe semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Integrated circuit having multiple power/ground connections...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Integrated circuit substrate having laminated laser-embedded...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
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Profile ID: LFUS-PAI-P-2292301

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