Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2005-08-16
2005-08-16
Cuneo, Kamand (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S256000, C174S257000, C174S264000, C174S261000
Reexamination Certificate
active
06930257
ABSTRACT:
An integrated circuit substrate having laminated laser-embedded circuit layers provides a multi-layer high-density mounting and interconnect structure for integrated circuits. A prepared substrate, which may be a rigid double-sided dielectric or film dielectric with conductive patterns plated, etched or printed on one or both sides is laminated with a thin-film dielectric on one or both sides. The thin-film is laser-ablated to form channels and via apertures and conductive material is plated or paste screened into the channels and apertures, forming a conductive interconnect pattern that is isolated by the channel sides and vias through to the conductive patterns on the prepared substrate. An integrated circuit die and external terminals can then be attached to the substrate, providing an integrated circuit having a high-density interconnect.
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NN 9311589 IBM Nov. 1, 1993.
Hiner David Jon
Huemoeller Ronald Patrick
Rusli Sukianto
Amkor Technology Inc.
Cuneo Kamand
Patel Ishwar (I. B).
Weiss, Moy & Harris P.C.
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