4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents

David James Alcoe

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Elastomeric structure with multi-layered elastomer and constrain

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent

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Electronic component test apparatus with rotational probe

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent

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Electronic component test apparatus with rotational probe and co

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent

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Electronic package with compressible heatsink structure

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component
Patent

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Electronic package with compressible heatsink structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Profile ID: LFUS-PAI-P-65927

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