David J. Reed

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Coplanar die to substrate bond method

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
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Electronic package having a non-oxide ceramic bonded to metal an

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
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Glass bonding means and method

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Glass bonding means and method

Compositions: ceramic – Ceramic compositions – Glass compositions – compositions containing glass other than...
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Glass bonding method

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Profile ID: LFUS-PAI-P-648304

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