Coplanar die to substrate bond method

Details Coplanar die to substrate bond method Coplanar die to substrate bond method

1987-06-01

1988-11-01

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156293, 29740, 174 52FP, 357 74, 357 80, B32B 3106

Patent

active

047817755

ABSTRACT:
A coplanar die to substrate bond method wherein a plurality of die are aligned on a silicon wafer substrate in a predetermined relationship and a slurry of glass is applied to bond them together. This occurs while either on a flat or a grooved plate. When the silicon wafer substrate and the plurality of die are ready for firing, they are placed on a grooved plate so that grooves are below the glass thereby decreasing the capillary force which commonly causes overflow. With reduced overflow, the bonding can be done at a higher temperature to reduce underflow. Because there is no underflow or overflow using this process, a greater degree of coplanarity is achieved thereby making future processing steps, such as the processing of interconnect lines, much easier to perform.

REFERENCES:
patent: 4300978 (1981-11-01), Whitemore et al.
patent: 4620216 (1986-10-01), Horvath
patent: 4630096 (1986-12-01), Drye et al.

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