Glass bonding means and method

Details Glass bonding means and method Glass bonding means and method

1984-05-25

1985-05-07

McCarthy, Helen M.

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 18, 501 22, 501 42, 501 75, 501 76, C03C 310, C03C 312

Patent

active

045158983

ABSTRACT:
An improved semiconductor die bonding structure and method for electrical devices is described which utilizes a ductile foil between the semiconductor die and the base of the device package. The die is sealed to the foil with a die bonding material formed from a titania free base glass to which has been added 23.6 to 36.4 weight percent lead titanate powder to give a glass plus ceramic mixture consisting essentially of (by weight percent) 2.5-10.7% GeO.sub.2, 0-2.3% SiO.sub.2, 58.6-78.5% PbO, 0-5.3% PbF.sub.2, 7-13% B.sub.2 O.sub.3, 2.5-6.9% Al.sub.2 O.sub.3, 0-5.3% ZnO, 0.4-2.3% V.sub.2 O.sub.5, 0-5.3% CdO, and 6.2-9.6% TiO.sub.2. The ductile foil is bonded to the ceramic package base directly without intermediate layers or alternatively by means of an improved foil bonding glass material consisting essentially of (by weight percent) 10-15% SiO.sub.2, 45-55% PbO, 8-12% ZnO, 2-5% Al.sub.2 O.sub.3, and 25-30% B.sub.2 O.sub.3.

REFERENCES:
patent: 3907535 (1975-09-01), Muller
patent: 3964920 (1976-06-01), Davis et al.
patent: 4184189 (1980-01-01), Davis et al.
patent: 4405722 (1983-09-01), Kokubu et al.

Affiliated with

Also associated with

Rating

Glass bonding means and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Glass bonding means and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Glass bonding means and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1800566