Electronic package having a non-oxide ceramic bonded to metal an

Details Electronic package having a non-oxide ceramic bonded to metal an Electronic package having a non-oxide ceramic bonded to metal an

1991-11-21

1992-11-17

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361386, 361388, 357 81, 29840, 295921, H05K 720

Patent

active

051648857

ABSTRACT:
A non-oxide ceramic (16) for electronic packages and a method of producing electronic packages using a non-oxide ceramic is provided. In accordance with the present invention, the non-oxide ceramic (16) is coated with silicon dioxide (15) and a bonding glass (14) having diboron trioxide is used to attach other package components such as semiconductor chips (18), leadframes (13), and heatsinks (11) to the non-oxide ceramic (16).

REFERENCES:
patent: 4554613 (1985-11-01), Kaufman
patent: 4922378 (1990-05-01), Malhi et al.
patent: 5070936 (1991-12-01), Carroll et al.
Hazen et al, "Thin Film Protective Coatings for Processing Aluminum Nitride Substrates", ISHM Advanced Technology Workshop-Aluminum Nitride Technology, Mar. 14, 1991.

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